Benefit from over 25 years of industry expertise with Atomic System & Design, a leading provider of IC programming services in Singapore. Our value-added services ensure enhanced production efficiency, cost savings, and high reliability while maintaining superior quality standards.
Our principal service covers the provision of programming services and various types of hardware for our customers, with pre-written programmes provided by customers to be coded into the integrated circuits.
We support a wide range of customers, both local and overseas.
- IC Programming – serialization, firmware control, custom algorithms for encrypted key loading and embedded trusted certificates
- Package Conversions – tape and reel, tray, tube
- Component Baking for exposed moisture-sensitive components
- Laser Marking
- Lead Scanning
- ESD Dry Packing with desiccant and humidity indicators
Integrated Circuit (IC) Programming
Our Integrated Circuit (IC) Programming services contribute to increased production line efficiency, saving time and costs during in-circuit testing. We support a wide range of technologies and packages, offering commercially available standard sockets or customized options. With strong vendor relationships, we provide prompt first article turnarounds and can accommodate flexible runs from small prototypes to high-volume production. Supported devices include Memory, MCUs, CPLD, UFS & eMMC in various packages like BGA, QFP, SOIC, SOC, TSOP, and more. Additional services encompass serialization, controlling firmware changes, custom algorithms for encrypted key loading, and embedded trusted certificates, all backed by our commitment to quality and secure programming adhering to ISO 9001 and ISO/IEC 27001 standards.
Tape and Reel
Complementing our IC programming services, our Tape and Reel offerings provide quick, high-quality services to ensure production-ready components.
Baking and Dry Packing
For moisture control, our Baking and Dry Packing services eliminate moisture ingress, especially for older components or those sourced from alternative suppliers. Our temperature and time-controlled ovens cater to delicate and hard-to-handle components, and processed products can be returned in customers’ preferred packaging.
Components are returned in your preferred packaging—such as reels or trays—and securely dry-bagged.
Laser Marking
Facilitate traceability and identification throughout a component’s lifecycle with our Laser Marking services. This non-contact method uses laser thermal effects for pollution-free, fast marking of clear text, model, manufacturer, and other information without damaging the component’s surface.
Lead Inspection
Our Lead Inspection services enhance yield and reduce component defects with machine learning, vision-enabled auto-handlers, and standalone inspection machines.
We have built in a rigorous quality monitoring process that detects defects such as scratched, twisted, bent, or missing pins, and includes 3D and 2D inspection capabilities for lead integrity, part orientation, and mark verification.
FIELDS OF APPLICATION
Multiple devices:
Microcontroller, Flash, EPROM and EEPROM, FPGA & PLD, DSP, Microcontroller with Flash base and more
Multiple packages:
BGA, CSP, DIP, LCC, MLF, PGA, PLCC, QFP, SCSP, SO, SOP, SOJ, SOIC, SSOIC, TSOP, TSSOP, and many more
WHY OUTSOURCE PROGRAMMING TO ATOMIC SYSTEM & DESIGN
Achieve better yield
No capital investment
Quick turnaround time
Strict process control for programming
Wide range of support for solid state memory storage devices and packages
Higher cost-effectiveness per-device programming
Reliable and high end programmers for all programming processes
Wide range of socket modules available to support different packages